Specialty Ion Exchange Resin for Silicon Wafer Cutting Fluids Recycling Use


D1 is an cation exchange resin synthesized with special technology. For its superior features of highly firm and solid structure and low swelling rate of granularity after reversible ionic replacement reactions, this resin performs with its high anti-osmotic efficiency and good oxidation resistance. This resin remains functioning with excellent ions exchange &adsorption and de-coloring performance within organic solutions, for its superior feature that mesh porosity of the resin does not vary from solution swelling. It is specialized in removing mineral substances and organic molecules from industrial waste fluids for recovery of its original before-use composition and thus for further recycling use.

Specifically, the most widely used scenario of D1 is to adsorb such non-polarity and positive-polarity organic molecules as dark pigments and to remove metal cations remaining in the crystalline silicon cutting filtrate used in the production of photovoltaic solar silicon wafers. Depending on solution PH, combing D1 with D2 which is used for removal of strong-acid anions, or with D3 for separating both strong-acid and weak-acid radicals, is an often-used demineralization and decolorization alternative for recovering original PH, viscosity, refractive index, conductance, colorless &transparent properties of polyethylene glycol(PEG) aligning with its properties in fresh cutting fluids, serving the ultimate purpose of recycling use for silicon cell production lines in photovoltaic industry.

Matrix: Styrene-based Polymer
Physical form: Spherical beads
Moisture holding capacity(%): 45 to 55%
Ionic form as shipped: Na+
Total bulk exchange capacity: ≥1.9mmol/mL
Moisture true density: 1.18~1.28g/mL
Moisture bulk density: 0.76~0.85g/mL
Effective particle size: 0.40~0.70mm
Particle size: 0.315~1.25mm
Uniformity coefficient: ≤1.6
Integrated beads ratio after grinding test: ≥95℅
Max swelling rate of resin after ionic state transition: Na+ ->H+ : 6%
Maximum operating temperature: 120°C
Minimum bed depth: 800mm
Service flow rate: 5~40 BV*/h
Maximum service velocity: 60 m/h
Regenerant: NaCl HCl H2SO4
Level(Counted by 100%): 80~220g/L 50-150g/L 80~180g/L
Concentration: 5~10℅ 5~8℅0.7~6℅
Flow rate: 2~8 BV*/h 2~5 BV*/h2~20 BV*/h
Minimum contact time: 30min
Slow rinse: 2 BV at regeneration flow rate
Fast rinse: 4~8 BV at service flow rate
*1 BV(Bed Volume)= 1 solution per resin