Specialty Ion Exchange Resin for Silicon Wafer Cutting Fluids Recycling Use

PRODUCT DATA SHEET:

D2 is an anion exchange resin synthesized with special technology. For its superior features of highly firm and solid structure and low swelling rate of granularity after reversible ionic replacement reactions, this resin performs with its high anti-osmotic efficiency and good oxidation resistance. This resin remains functioning with excellent ions exchange &adsorption and de-coloring performance within organic solutions, for its superior feature that mesh porosity of the resin does not vary from solution swelling. It is specialized in removing radicals of minerals(ie. metal salts) and organic molecules from industrial waste fluids for recovery of its original before-use composition and thus for further recycling use.

Specifically, the most widely used scenario of D2 is to remove such non-polarity and negative-polarity organic molecules as dark pigments and in particular selective removal of strong-acid anions of minerals remaining in the crystalline silicon cutting filtrate used in the production of photovoltaic solar silicon wafers.

Depending on filtrate PH and solute composition, combing D1 with D2 together is a commonly-used scheme for removing strong-acid minerals(ie. metal salts) for demineralization and separating organic molecules of both negative-polarity and non-polarity(ie. liquid color). Alternatively, with D3 for removal of both strong-acid and weak-acid radicals, if applicable, in order to recover original PH, viscosity, refractive index, conductance, colorless &transparent properties of polyethylene glycol(PEG) aligning with its properties in fresh cutting fluids, serving the ultimate purpose of recycling use for silicon cell production lines in photovoltaic industry.

PROPERTIES:
TECH-INDEXES: SPECIFICATIONS:
Matrix: Styrene-based Polymer
Physical form: Offwhite Opaque Spherical beads
Moisture holding capacity(%): 50 to 60%
Ionic form as shipped: Free Amine(FA) Form
Total bulk exchange capacity: ≥1.41mmol/mL
Moisture true density: 1.03~1.07g/mL
Moisture bulk density: 0.65~0.72g/mL
Effective particle size: 0.40~0.70mm
Particle size: 0.315~1.25mm
Uniformity coefficient: ≤1.6
Integrated beads ratio after grinding test: ≥90℅
Max Swelling Rate of Resin after Ionic State Transition: FA ->Cl : 20%
SUGGESTED OPERATING CONDITIONS:
Maximum operating temperature: 100°C
Minimum bed depth: 700mm
Service flow rate: 5~40 BV*/h
Maximum service velocity: 60 m/h
Regenerant: NaOH Na2CO3   NH3H2O
Level(Counted by100%) 50-110g/L 60-140g/L 40~100g/L
Concentration: 2~4℅ 2~4℅2~4℅
Flow rate: 2~8 BV*/h 4~8 BV*/h2~8 BV*/h
Minimum contact time: 30min
Slow rinse: 5 BV at regeneration flow rate
Fast rinse: 10 BV at service flow rate
*1 BV(Bed Volume)= 1 solution per resin