Specialty Ion Exchange Resin for Silicon Wafer Cutting Fluids Recycling Use


D3 is an anion exchange resin synthesized with special technology. For its superior features of highly firm and solid structure and low swelling rate of granularity after reversible ionic replacement reactions, this resin performs with its high anti-osmotic efficiency and good oxidation resistance. This resin remains functioning with excellent ions exchange &adsorption and de-coloring performance within organic solutions, for its superior feature that mesh porosity of the resin does not vary from solution swelling. It is specialized in removing radicals of minerals(ie. metal salts) and organic molecules from industrial waste fluids for recovery of its original before-use composition and thus for further recycling use.

Specifically, the most widely used scenario of D3 is to remove such non-polarity or negative-polarity organic molecules as dark pigments and to completely eliminate both strong-acid and weak-acid anions of minerals remaining in the crystalline silicon cutting filtrate used in the production of photovoltaic solar silicon wafers.

Combing D1 with D3 together is a widely-applied scheme for thorough demineralization and recovery of original PH, viscosity, refractive index, conductance, colorless &transparent properties of polyethylene glycol(PEG) aligning with its properties in fresh cutting fluids, serving the ultimate purpose of recycling use for silicon cell production lines in photovoltaic industry.

Matrix: Styrene-based Polymer
Physical form: Milky white opaque spherical beads
Moisture holding capacity(%): 50 to 56%
Ionic form as shipped: Cl
Total bulk exchange capacity: ≥1.25mmol/mL
Moisture true density: 1.07~1.10g/mL
Moisture bulk density: 0.65~0.73g/mL
Effective particle size: 0.50~0.70mm
Particle size: 0.45~1.25mm
Uniformity coefficient: ≤1.5
Integrated beads ratio after grinding test: ≥95℅
Max swelling rate of resin after ionic state transition: Cl ->OH: 20%
Maximum operating temperature: 60°C
Minimum bed depth: 700mm
Service flow rate: 10~20 BV*/h
Maximum service velocity: 25 m/h
Regenerant: NaOH
Level(Counted by 100%): 60~150g/L
Concentration: 2~4℅
Flow rate: 2~8 BV*/h
Minimum contact time: 40min
Slow rinse: 2 BV at regeneration flow rate
Fast rinse:4~8 BV at service flow rate
*1 BV(Bed Volume)= 1 solution per resin